High-Efficiency SMT Equipment: The Future of Surface Mount Technology and PCB Assembly

Table of Content

Types of PCB Assembly

Microchips are among the primary components of any electronic device. They are attached to dielectric plates using various types of printed circuit board (PCB) assembly methods, often involving advanced SMT equipment. The soldering of leads to metallized tracks ensures their inclusion in the overall conductive circuit and establishes contact with other working nodes. Depending on the type and purpose of the microchips, they are mounted on the plate using one of the following assembly methods:

SMD (Surface Mount Device) — Surface mounting
DIP (Dual In-line Package, also known as Through-Hole Technology, TNT) — Through-hole mounting
SMD + DIP — Mixed mounting

Surface mounting involves attaching electronic components directly to the external sides of the PCB. The leads are soldered to the metallized tracks without passing through the plate. This allows conductive circuits to be applied to both sides of the board without contacting each other, effectively doubling the usable working area for attaching components. This method often relies on advanced SMT equipment to achieve high precision and efficiency.

Through-hole mounting involves securing microchips into holes on the PCB. Contacts are soldered to the metallized layer inside the holes and firmly fixed in place. The distinguishing feature of this method is that the leads pass through the dielectric plate, creating solder bumps on the opposite side, which are subsequently trimmed.

Each type of assembly can be used independently or in combination with another. In the production of complex microchips, elements are often secured using both surface and through-hole methods. This ensures the reliable operation of components on both single and multi-layer boards, leveraging the benefits of SMT equipment and traditional methods.

The Future of Surface Mount Technology and PCB Assembly 02

Which Types of PCB Assembly Are Better

The choice between SMD or DIP for securing elements on the plate depends on their purpose and the functionality requirements of the finished microchip. Most PCBs are created by combining surface and through-hole mounting. Each method has its own advantages and disadvantages, making it difficult to objectively determine which is better or more efficient.

However, it is worth noting that from the mid-1980s, DIP was the primary method for securing elements. A comprehensive theoretical base was formed, and functional equipment for creating holes and soldering microchips was developed. Nevertheless, this method has been losing popularity over the past 20 years, being supplanted by surface mounting, primarily due to advancements in SMT equipment.

Virtually every board seen today predominantly consists of SMD elements. The proportion of DIP components in the total number of microchips generally does not exceed 25-30%. Both types of PCB assembly are continuously used, but surface mounting is rapidly gaining popularity, while through-hole mounting is gradually becoming less relevant.

Advantages and Disadvantages of Each Assembly Method

The methods of surface and through-hole mounting elements on the plate have several characteristics that reflect the advantages and disadvantages of each assembly type.

Advantages of SMT Equipment:

Smaller board sizes due to the use of both sides.
Easier processing of plates (no need for drilling and metallizing holes).
Smaller size and weight of components and their leads.
Convenience and reliability in securing elements.
Compact finished product.
Possibility of batch soldering all microchips in an oven simultaneously.
No need for post-mounting plate processing.
Enhanced by the use of high-precision SMT equipment.

Disadvantages of SMT Equipment:

Requirement for functional SMT equipment and highly qualified engineers.
Need for precise consideration of electro-thermal characteristics of elements (to avoid overheating during soldering).
Requirement to use only high-quality components.

This method primarily uses specialized semi-automatic SMT equipment, including machines for applying solder paste and machines that ensure the capture and installation of components under the control of experienced engineers. This assembly method is more amenable to automation, enhancing its relevance in mass production and supported by advanced SMT equipment.

Advantages of DIP Assembly:

Reliable soldering of all contacts in metallized holes.
Ability to use medium-quality elements.
Reduced risk of overheating, damage, and delamination of components.
Ability to solder leads to the internal layers of the plate.

Disadvantages of DIP Assembly:

Larger size and weight of each element and lead contact.
Necessity for pre- and post-mounting plate processing (creating and metallizing holes, trimming leads).
Larger size and weight of the finished product.
Slower transmission of high-speed signals.

This method of securing elements is mainly carried out manually. An engineer with a soldering iron fixes each contact, which takes considerable time. Therefore, this assembly method is relevant for small-scale production or the creation of highly complex custom boards. It is also the primary method used in repair processes. Despite the availability of semi-automatic equipment, machines are usually employed only for creating and metallizing holes.

Which Type of PCB Assembly to Choose

Determining the most suitable method for securing elements depends on the technical documentation, purpose, and application goals of the microchips. Modern trends aimed at enhancing device functionality while reducing their size and weight position surface mounting as the optimal solution.

Through-hole mounting remains indispensable for creating multi-layer boards. The proven reliability of this method makes it a traditional choice for manufacturing power supplies, control panels, power plant equipment, and more. The appropriate type of PCB assembly can only be determined by a highly qualified specialist with relevant education and invaluable practical experience.

Conclusion and Inquiry

Determining the most suitable method for securing elements depends on the technical documentation, purpose, and application goals of the microchips. Modern trends aimed at enhancing device functionality while reducing their size and weight position surface mounting as the optimal solution.

Through-hole mounting remains indispensable for creating multi-layer boards. The proven reliability of this method makes it a traditional choice for manufacturing power supplies, control panels, power plant equipment, and more. The appropriate type of PCB assembly can only be determined by a highly qualified specialist with relevant education and invaluable practical experience.

Ready to upgrade your PCB assembly process? Contact us today to learn more about our state-of-the-art SMT equipment and how our advanced surface mount technology can enhance your production line. Our experts are here to provide you with tailored solutions and support for all your electronic assembly needs.

High-Efficiency SMT Equipment: The Future of Surface Mount Technology and PCB Assembly