DIP Process in EMS Manufacturing
Benefits of DIP in EMS Manufacturing
Durability: DIP components are often more durable and can withstand higher mechanical stress.
Compatibility: Some components are only available in DIP formats, making this process essential for certain products.
Reliability: The solder joints in DIP can be more robust, which is beneficial for products subjected to physical stress.
Overview of DIP Process
DIP is a method for inserting components with leads into holes drilled in the PCB. The DIP process in EMS manufacturing includes:
- Component Insertion: Components are manually or automatically inserted into the PCB. This step can be labor-intensive but is crucial for certain types of components.
- Soldering: Components are soldered using wave soldering or selective soldering, which ensures strong and reliable connections.
- Depaneling: Cutting the assembled boards into individual units, similar to the SMT process, but often requiring different techniques due to the nature of the components.
Equipment Used in DIP
A typical DIP line in EMS manufacturing includes:
- Insertion Line: For component insertion, which can be automated to some extent to increase efficiency.
- Wave Loader: Feeds PCBs into the wave soldering machine, ensuring they are correctly positioned.
- External Sprayer: Applies flux to the PCBs, which is essential for good soldering.
- Wave Soldering Machine: Soldering the components by passing the PCB over a wave of molten solder.
- Wave Unloader: Unloads PCBs from the wave soldering machine, ready for inspection or further processing.
- Conveyor Belt: Transfers PCBs between processes, maintaining a smooth production flow.
Production Capacity and Power Requirements
SMT Production Capacity
Capacity: Two pick and place machines can handle 35,000-45,000 components per hour (CHIP/H).
Total Power: 80KW.
Operating Power: 17KW.
Product Compatibility: Suitable for up to 100 types of SMD components, sizes ranging from 0201 to 45MM, with a maximum PCB width of 350mm.
DIP Production Capacity
Capacity: Depends on component count and personnel. The process can be slower than SMT due to manual insertion.
Total Power: 35.5KW.
Operating Power: 10.5KW.
Product Compatibility: Suitable for medium to high-end products, with a maximum PCB width of 350mm.
Combined SMT and DIP Production Requirements
Workshop Size: Requires a space of 30 meters in length and 15 meters in width, totaling 450 square meters. This space must accommodate all equipment and allow for smooth workflow.
