SMT Machine

I.C.T Split Unit SMT Reflow Soldering Oven

Reflow Soldering Oven
SMD Reflow Oven
PCB Reflow Oven
SMD Reflow Oven
SMT Reflow Soldering Oven
Reflow Soldering Oven
SMD Reflow Oven
PCB Reflow Oven
SMD Reflow Oven
SMT Reflow Soldering Oven

I.C.T Split Unit SMT Reflow Soldering Oven

  • The SMT Reflow Soldering Oven offers Split Unit functionality for precise temperature control during soldering.
  • This reflow oven is renowned for its reliable heating performance and advanced temperature control system.
  • The SMT Reflow Soldering Oven is a market-proven product, backed by years of technical expertise and customer trust.
  • Ideal for diverse applications, the oven is a perfect fit for communications, automotive electronics, and other consumer electronics products.

Overview

SMT Reflow Soldering Oven

I.C.T-Split Unit SMT Reflow Soldering Oven

The Split Unit SMT Reflow Soldering Oven: the ultimate solution for constrained spaces.

I.C.T’s L Series SMT Reflow Soldering Oven represents years of market insights and refinement. Its split unit functionality allows precise control over each soldering stage, ensuring impeccable results.

The L Series Reflow Oven has consistently held a significant share of the market, thanks to its unmatched heating performance and temperature control system. It represents I.C.T’s commitment to continuous technical research and development, making it a mature product in the industry.

Designed to meet the evolving needs of various welding processes, the L Series is ideal for applications in communications, automotive electronics, home appliances, computers, and other consumer electronic products. Its high-end features are tailored to enhance customer competitiveness in today’s dynamic market landscape.

Experience the reliability and efficiency of the L Series SMT Reflow Soldering Oven – your partner in achieving superior soldering results across diverse applications.

Key Features

Here are the revised and enhanced 9 features of the I.C.T SMT Reflow Soldering Oven, randomly integrating the keyword:

  • Split Unit Design for Space Efficiency:
    The SMT Reflow Soldering Oven boasts a split unit design, making it the ultimate solution for constrained workspaces. Its compact yet powerful structure maximizes workspace utilization without compromising performance.
  • Precision Control System for Accurate Temperature Management:
    Equipped with a state-of-the-art PC+Siemens PLC control system, the oven ensures precise temperature control with a stability rate exceeding 99.99%. This ensures consistent soldering results across all batches.
  • Advanced Hot Air System for Uniform Heating:
    Utilizing top-tier heating modules and an optimal temperature zone interval design, the SMT Reflow Soldering Oven achieves uniform temperature distribution and consistency. Temperature stabilization is achieved within 20 minutes with ±1℃ accuracy.
  • Intuitive Monitoring Software for Seamless Operation:
    The oven features a user-friendly Windows interface with multi-language support and operator password management. Its comprehensive functions include operation records, temperature curve analysis, fault diagnosis, and real-time process monitoring.
  • Efficient Cooling System for Rapid Temperature Adjustment:
    Incorporating an innovative cooling zone with adjustable settings, the SMT Reflow Oven effectively meets diverse cooling requirements, ensuring optimized production cycles.
  • Enhanced Temperature Protection for Safe Operation:
    The oven implements multiple layers of third-party over-temperature protection mechanisms to ensure safe and reliable operation, minimizing the risk of equipment damage or accidents.
  • Compliance with Global Industry Standards:
    Our SMT Reflow Soldering Oven meets CE, CCC, UL, and other global industry standards, guaranteeing its quality, reliability, and compatibility with international regulations.
  • User-Centric Design for Easy Maintenance:
    Featuring fault detection, maintenance reminders, economy functions, and tool-free maintenance options, the oven minimizes equipment downtime and maximizes operational efficiency.
  • Innovative Heating Module for High-Capacity Production:
    Utilizing a transverse reflow design, the SMT Reflow Soldering Oven maintains accurate temperature curves and high production capacity, catering to various industries including automotive, communications, and consumer electronics.

Specification

Model L8 L10
Dimension (L*W*H)mm 5125x1430x1530 5805x1430x1530
Weight Approx. 2100KG Approx. 2315KG
Number Of Heating Zones Up8/Bottom8 Up10/Bottom10
Length Of Heating Zones 3110mm 3892mm
Rail Width Adjustment Manual adjustment (Option: Automatic)
Exhaust Volume 10M3/min*2 Exhausts
Control System PLC+Computer
Temperature Control Method PID + SSR
Transmission Agent Chain + Mesh
Electric Supply Required 5 Wire System 3P, N, PE 380 VAC ± 5%, 50 Hz. Other voltages upon request
Power For Warm Up 64KW 80KW
Power Consumption 10KW 12KW
Warming Time Approx.25 minute
Temp. Setting Range Room Temp.– 300°C
Conveyor Height 900+/-20mm
Conveyor Speed Range 300~2000mm/mi
Fixed Rail Side Front Fixed (Option:Rear Fixed)
Cooling Method Forced-Air Motor and fan (Standard)

* If further parameters are required, please feel free to contact us for additional details.

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I.C.T Split Unit SMT Reflow Soldering Oven, File Size: 1MB

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FAQ

1. Why choose the Split Unit SMT Reflow Soldering Oven?

2. How does the SMT Reflow Soldering Oven handle PCB transportation?

3. Can the oven adjust guide rail width?

4. What's the control system like?

5. How does the oven prevent contamination?

6. What about cooling?

Comprehensive SMT Solutions with Global Reach

I.C.T offers adaptable SMT solutions for diverse needs. Our top-notch service, online support, and cutting edge engineering ensure high quality processes. Committed to excellent service, we maximize production line productivity with outstanding quality driven by lean processes, employee integration, proactive planning, and continuous improvement.

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