Multi-frequency PSLM: Our SMT SPI machine features Multi-frequency PSLM technology, offering ±1200um detection height and enhanced accuracy.
Phase Modulation Profilermetry (PMP): Achieve precision with our SMT SPI machine, boasting PMP technology for a 0.37um height resolution.
High Resolution and High Frame Rate Image Processing Unit: Experience precise 2D/3D measurements with our SMT SPI machine, equipped with an Active RGB 2D Light Source and patented RGB Tune function.
Overview
I.C.T-X7900 BGA X-Ray Inspection Machine
Our BGA X-ray inspection system, an integral part of the X-7900 inspection machine electronic semiconductor testing equipment, offers unparalleled precision and reliability in detecting defects within integrated circuit chip semiconductors. Capable of inspecting a variety of components including BGA, IGBT, flip-chip, and PCBA weldments, our BGA X-ray system ensures the highest quality standards in industries ranging from LED and photovoltaics to automotive manufacturing.
Versatile Applications:
Beyond semiconductor testing, our BGA X-ray inspection technology finds extensive application across diverse industrial sectors. From automotive parts manufacturing to foundry testing, pressure vessel and pipe welding quality assessment, and new material analysis, our system excels in providing comprehensive inspection solutions. Additionally, it enables precise defect detection in various types of batteries, including power batteries, cylindrical cells, flexible packaging, square shells, laminates, and more. With its versatility and accuracy, our BGA X-ray inspection system stands as a cornerstone for quality assurance in modern industrial settings.
Key Features
Effortless Batch Detection with CNC Program: Automate batch detection with precision using the CNC program, ensuring seamless inspection across different sample positions.
Precision Measurement of Length and Width: Enhance accuracy by precisely measuring the length and width of specific areas within the detection zone, guaranteeing meticulous inspection results.
Visual Navigation Interface for Precise Positioning: Achieve unprecedented precision with a visual navigation interface, allowing precise positioning through X-Y joystick displacement.
Bubble Measurement for Comprehensive Analysis: Streamline bubble analysis with one-key measurement, covering bubble size, void rate, and tin climbing height, ensuring thorough inspection.
Automated SMT X Ray Inspection Light Tube Control: Optimize efficiency with automatic ON/OFF control of the SMT X Ray Inspection light tube, facilitating batch detection of samples.
Japanese SMT X Ray Inspection Light Tube for Unmatched Accuracy: Elevate detection accuracy to 1um with the inclusion of a high-precision Japanese SMT X-ray Machine light tube.
Ergonomic Design and User-Friendly Interface: Prioritize user comfort with an ergonomic design and a friendly man-machine interface, promoting efficient and comfortable operation.
Revised Summary:
I.C.T BGA X-ray Machine boasts several standout features that redefine precision and efficiency in batch detection and analysis:
Effortless Batch Detection: Seamlessly automate batch detection across various sample positions with precision, thanks to the CNC program.
Precise Measurement: Enhance accuracy by meticulously measuring length and width within the detection zone, ensuring thorough inspection.
Visual Navigation Interface: Achieve unparalleled precision in positioning through the user-friendly visual navigation interface.
Comprehensive Bubble Analysis: Streamline bubble analysis with one-key measurement, covering critical parameters for thorough inspection.
Automated Light Tube Control: Maximize efficiency with automatic control of the SMT X Ray Inspection light tube, facilitating batch detection.
Japanese Precision: Elevate detection accuracy with a high-precision Japanese SMT X-ray Machine light tube.
User-Friendly Design: Prioritize user comfort and efficiency with an ergonomic design and intuitive interface, ensuring smooth operation.
1. What is a I.C.T-X7900 BGA X-ray machine, and how does it improve inspection processes?
A BGA X-ray machine is an advanced inspection tool utilized in industries like electronics manufacturing and automotive to detect defects in integrated circuit chip semiconductors, such as BGA components. It enhances inspection processes by providing precise measurements, visual navigation interfaces, and automated batch detection capabilities, ensuring thorough and accurate analysis of components.
2. How does the inclusion of I.C.T's technology enhance the performance of a I.C.T-X7900 BGA X-ray machine?
I.C.T's technology integrated into BGA X-ray machines ensures unmatched precision and reliability in defect detection. With features like automated light tube control and high-precision Japanese X-ray tubes, I.C.T-branded machines offer enhanced accuracy down to 1um, providing manufacturers with confidence in their inspection results.
3. Can a BGA X-ray machine accommodate various sample sizes?
Yes, a BGA X-ray machine, particularly those equipped with versatile stages, can accommodate a diverse range of sample sizes. This flexibility, combined with optional 360° rotation capabilities, enables comprehensive inspection of components regardless of their dimensions or orientations.
4. How does the visual navigation interface contribute to the efficiency of BGA inspection?
The visual navigation interface integrated into BGA X-ray machines facilitates precise positioning of samples using X-Y joystick displacement. This feature allows operators to navigate through inspection zones with unparalleled accuracy, ensuring thorough analysis and efficient detection of defects.
5. What are the key benefits of using a I.C.T-X7900 BGA X-ray machine for bubble analysis?
BGA X-ray machines streamline bubble analysis with one-key measurement functionality, covering critical parameters such as bubble size, void rate, and tin climbing height. This comprehensive analysis, coupled with precision measurement capabilities, ensures thorough inspection and reliable defect detection.
6. How does the ergonomic design of a BGA X-ray machine impact user experience?
BGA X-ray machines designed with user comfort in mind feature ergonomic designs and user-friendly interfaces. These design elements promote efficient and comfortable operation, allowing operators to perform inspections with ease and accuracy, ultimately enhancing overall productivity and workflow efficiency.
I.C.T offers adaptable SMT solutions for diverse needs. Our top-notch service, online support, and cutting edge engineering ensure high quality processes. Committed to excellent service, we maximize production line productivity with outstanding quality driven by lean processes, employee integration, proactive planning, and continuous improvement.
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