What Are the Key Automation Features of Solder Paste Printer?
1. Automatic PCB Alignment:Ensures precise alignment of PCBs for each print, enhancing accuracy and reducing errors.
2. Adjustable Squeegee Pressure:Allows customization of squeegee pressure to meet different printing requirements, ensuring optimal paste application.
3. Automatic Printing Function:Boosts production efficiency by automating the printing process, reducing manual intervention.
4. Automatic Stencil Cleaning System:Keeps the stencil clean to maintain print quality and reduce downtime for manual cleaning.
5. Programmable Motor-Controlled Separation Speed and Distance:Provides multiple separation methods by controlling the speed and distance of the motor, ensuring versatile operation.
6. Multi-Functional PCB Positioning System:Facilitates precise PCB positioning, enhancing the accuracy of the printing process.
7. Programmable PCB Lifting Platform:Ensures the PCB is raised to the appropriate height for printing, improving the consistency of solder paste application.
8. Automatically Adjusting Suspended Print Head:Supports real-time pressure feedback and squeegee pressure balancing, enhancing the uniformity of the solder paste spread.
9. Automatic SPI 2D Inspection:Incorporates an automatic Solder Paste Inspection (SPI) system with 2D capabilities to detect and correct printing defects in real-time.